Optical Communication
Case 1:Chip Alignment Detection for Bonding
Customer Demand

1. For chip alignment during bonding, clear and distinct black-and-white images of both edges of the chip slot in the fixture are required to ensure the positional accuracy of the chip.

2. Existing solution: VST 2X telecentric lens + 6X telecentric lens + combined prism + red ring light.

Scheme Selection

Lens :MT2.0-65C+MT6.0-110C
Light source :ML-RQ3600-RGB

Detection Effect